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Latest / Chips, compute and energy

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TSMC, Bosch, Infineon and NXP form ESMC to build a €10bn+ chip fab in Dresden

See how this story connects

Source: TSMC

TSMC agreed on 8 August 2023 to take 70% of European Semiconductor Manufacturing Company, with Bosch, Infineon and NXP holding 10% each. The Dresden fab is planned at 40,000 300mm wafers a month on 28/22nm and 16/12nm processes, with total investment above €10 billion including EU and German public support. Construction was set for the second half of 2024 and production for the end of 2027.

Why it matters

TSMC committed to a fab in Germany, giving German and EU chip buyers a planned local supply of mature-node chips if public funding was confirmed.

When
8 Aug 2023
ID
WTA-N-2023-0164
Who
TSMC, Bosch, Infineon, NXP, ESMC

Summary by wheresthe.ai, from TSMC. Checked against the source on 9 Oct 2026.

Read the original at TSMC

Source copy: download the page text as saved on 18 Oct 2026 (PDF). Also held by the Internet Archive.

Next stop on this Storyline: Led toEuropean Commission clears €5bn German aid for TSMC-led ESMC fab in Dresden

Cite this story

WTA-N-2023-0164: “TSMC, Bosch, Infineon and NXP form ESMC to build a €10bn+ chip fab in Dresden.” wheresthe.ai, 8 Aug 2023. https://wheresthe.ai/d/de-esmc-tsmc-dresden-fab-joint-venture-2023-08/ (source: TSMC).

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