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European Commission clears €5bn German aid for TSMC-led ESMC fab in Dresden
See how this story connectsThe European Commission approved €5 billion of German state aid on 20 August 2024 for ESMC, a joint venture of TSMC, Bosch, Infineon and NXP, to build a fab in Dresden. The plant will make 28/22nm and 16/12nm FinFET chips on 300mm wafers, about 480,000 wafers a year, at full capacity by 2029.
Why it matters
The aid, assessed against the European Chips Act goals, brings TSMC manufacturing into the EU and gives European industrial chip buyers a local source.
- When
- 20 Aug 2024
- ID
WTA-N-2024-0119- Where
- European Union, Germany, Taiwan
- Who
- European Commission, ESMC, TSMC, Bosch, Infineon, NXP
- Topics
- Chips, Investment and financing
Summary by wheresthe.ai, from European Commission. Checked against the source on 9 Oct 2026.
Source copy: download the page as saved on 18 Oct 2026 (PDF). Also held by the Internet Archive.
Data to measure this
Compare the years before 2024 with the years since in these series.
- BACI product-level trade databaseCEPIIHarmonised annual bilateral trade for about 5,000 HS6 products among about 200 countries, including chips.
- UN ComtradeUnited Nations Statistics Division · paidBilateral goods trade by reporter, partner and product code, for example HS 8542 integrated circuits.
Cite this story
WTA-N-2024-0119: “European Commission clears €5bn German aid for TSMC-led ESMC fab in Dresden.” wheresthe.ai, 20 Aug 2024. https://wheresthe.ai/d/eu-de-esmc-dresden-5bn-state-aid-2024-08/ (source: European Commission).
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