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SK hynix completes HBM4 development and readies mass production

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SK hynix said on 12 September 2025 it had finished developing HBM4 memory and set up a system for mass production. The chips have 2,048 I/O terminals, double the previous generation, run at over 10 Gbps against the JEDEC standard of 8 Gbps, and are more than 40% more power efficient. They are made on SK hynix’s 1b-nanometre DRAM process with its Advanced MR-MUF packaging.

Why it matters

AI accelerator makers gained a supplier ready to mass-produce HBM4 memory, which SK hynix said would raise AI service performance by up to 69%.

When
12 Sep 2025
ID
WTA-N-2025-0116
Who
SK hynix
Topics
Chips

Summary by wheresthe.ai, from SK hynix and the reporting credited above. Checked against the source on 9 Oct 2026.

Source copy: download the page text as saved on 18 Oct 2026 (PDF). Also held by the Internet Archive.

Next stop on this Storyline: Led toSamsung signs letter of intent to supply memory and data centres for OpenAI’s Stargate

Cite this story

WTA-N-2025-0116: “SK hynix completes HBM4 development and readies mass production.” wheresthe.ai, 12 Sep 2025. https://wheresthe.ai/d/kr-sk-hynix-hbm4-development-complete-2025-09/ (source: SK hynix (press release via PR Newswire)).

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