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Latest / Chips, compute and energy

ReportComputeFrontierNetherlands ChinaConfirmed

ASML files hybrid bonding patents as Chinese firms adopt packaging technique

See how this story connects

Source: South China Morning Post

ASML, the Dutch semiconductor equipment maker, submitted 27 patent families related to hybrid bonding tools between December 2022 and November 2024, according to a SemiAnalysis report published on Thursday. SemiAnalysis said the number could be higher because publication delays affect recent filings. Hybrid bonding creates dense electrical connections by directly joining chips or silicon wafers. SemiAnalysis, citing industry media reports, said ASML had also begun developing the architecture for a hybrid bonder with the Dutch firms Prodrive Technologies and VDL ETG. The article also reports that major Chinese companies are adopting the technology to improve chip performance.

Why it matters

The filings suggest ASML is moving beyond lithography into back-end chip processes as demand for high-performance chips surges amid the global artificial intelligence boom.

When
16 Oct 2026
ID
WTA-N-2026-0310
Where
Netherlands, China
Who
ASML, SemiAnalysis, Prodrive Technologies, VDL ETG

Summary by wheresthe.ai, from South China Morning Post. Checked against the source on 16 Oct 2026.

Read the original at South China Morning Post

Source copy: download the page text as saved on 18 Oct 2026 (PDF). Also held by the Internet Archive.

Earlier in this Storyline: What led hereASML invests €1.3bn in Mistral AI for an 11% stake

Cite this story

WTA-N-2026-0310: “ASML files hybrid bonding patents as Chinese firms adopt packaging technique.” wheresthe.ai, 16 Oct 2026. https://wheresthe.ai/d/nl-asml-files-hybrid-bonding-patents-as-chinese-firms-adopt-2026-10/ (source: South China Morning Post).

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