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Latest / Chips, compute and energy

Rule changeComputeGovernmentUS ChinaConfirmed

Commerce bars CHIPS grant recipients from expanding advanced fabs in China for 10 years

See how this story connects

Source: U.S. Department of Commerce

The US Commerce Department issued the final national security guardrails rule for CHIPS for America funding on 22 September 2023. Recipients may not expand advanced chipmaking capacity in a foreign country of concern by more than 5% for 10 years, legacy capacity is capped at 10% growth, and joint research or licensing with foreign entities of concern is restricted; violations allow clawback of the whole award.

Why it matters

Chipmakers taking CHIPS grants accepted limits on growing fabs in China as a condition of US subsidies.

When
22 Sep 2023
ID
WTA-N-2023-0097
Who
Department of Commerce, CHIPS Program Office

Summary by wheresthe.ai, from U.S. Department of Commerce. Checked against the source on 9 Oct 2026.

Read the original at U.S. Department of Commerce

Source copy: download the page as saved on 18 Oct 2026 (PDF). Document the source offers: document 1 (PDF). Also held by the Internet Archive.

Next stop on this Storyline: Built on byUS offers TSMC up to $6.6bn in CHIPS Act grants for three Arizona fabs

Data to measure this

Compare the years before 2023 with the years since in these series.

  • BACI product-level trade databaseCEPIIHarmonised annual bilateral trade for about 5,000 HS6 products among about 200 countries, including chips.Years: 1995-present · annual · download · CSV · Covers before and after
  • UN ComtradeUnited Nations Statistics Division · paidBilateral goods trade by reporter, partner and product code, for example HS 8542 integrated circuits.monthly · api · CSV, JSON, API

All data for United States

Cite this story

WTA-N-2023-0097: “Commerce bars CHIPS grant recipients from expanding advanced fabs in China for 10 years.” wheresthe.ai, 22 Sep 2023. https://wheresthe.ai/d/us-chips-guardrails-final-rule-2023-09/ (source: U.S. Department of Commerce).

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